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First-Principle Physics Prediction of Advanced Chip Packaging

How a coupled thermal-structural solver catches package warpage before fabrication, and what it takes to trust the answer.

What you'll learn

• Which of 837,806 solder joints fails first, and how much margin each one has
• How a coupled solver carries a 110 mm package down to its 100 µm joints in one computation
• How thermal, mechanical and optical results come from one model, step by step through manufacturing

About 12 minutes to read